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Seminars For Engineers is proud to present:
Sealing
Technology For Packaging Processes
A Two Day Technical
Seminar
June 17-18, 2007 - Washington
D.C.
September 11-12, 2007 - Boston,
MA
December 4-5, 2007 - Philadelphia, PA

Sealing Technology for Packaging
Processes is designed to give engineers a complete
understanding of the various techniques for applying
heat to flexible and semi-rigid packaging in order to
achieve quality seals. A quality seal is critical for
product protection from environmental conditions and
also protects the user of the product/package from
possible dangerous toxins. This two day seminar covers
various sealing technologies, seal testing procedures,
adhesive sealing, polymer film and foil characteristics
and process/package validation.
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Any personnel in the R&D,
testing, process, design, fabrication and manufacturing
of food, pharmaceutical, medical, cosmetic, chemical,
veterinary or industrial product packaging can benefit
from this unique course. packaging, film and foil
personnel will also benefit.
Learn how to
choose the optimum sealing process for any
situation
Learn how
physics and chemistry apply to producing a high
integrity seal
Gain an
understanding of the mechanics of heat sealing equipment
and component interaction
Learn which
types of seals are acceptable in the marketplace
Learn the
process of integration of the sealing equipment into a
packaging line
View the heat
sealing process through technical data, graphs and
formulas
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Thermal
heat sealing behavior
Impulse
heat sealing
Dielectric heating theory
Ultrasonic welding
Secondary combinational sealing processes |

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Dr.
Duncan Darby, Associate Professor for the
Packaging Science Department at Clemson
University, is a recognized expert in the use
and manufacture of flexible
packaging. He has over 20 years of experience
in the flexible packaging industry, developing and
providing technical support for sealable
packaging materials for dairy products,
shelf-stable products, beverages, dry products,
confectionery products and pharmaceutical
products. Duncan has real-world,
hands-on experience with multiple package formats
including pouches, cups with lidding and
blisters with blister-backing, and has worked
with many horizontal and vertical packaging
lines. He holds a Doctorate in
Chemical Engineering from the University of
Louisville, KY, where his coursework concentrated
on polymer science and applications.
He teaches courses at Clemson, conducts short
courses on a variety of subjects and provides
consulting services for industrial
clients. Duncan has been a featured
speaker at the TAPPI PLACE, Global
Pouch and E5 conferences.
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For registration
information, please make a selection
below:
June 17-18, 2007 -
Washington D.C.
September
11-12, 2007 - Boston, MA
December 4-5, 2007 -
Philadelphia, PA
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If you have any questions about
our seminars please contact us at
info@SeminarsForEngineers.com or 1.973.560.9092.
Seminars For
Engineers 300 Madison Ave. Madison,
NJ 07940 USA 1.877.755.2272 Fax
1.973.884.1699
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